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           Home >> Products >>  Electronic Packaging Products  
Properties of PIM Electronic Package Parts：

Maerial
Thermal Expansivity（ppm/K）
Thermal Conductivity（W/mK）
Conductivity
（%IACS)
Density
（g/cm3）
W—Cu Alloy
6.5—7.2
165—180
31—35
16.1—16.4
Al/SiCp Compound
4—12
120—220
—
2.0—3.1
KOVAR Alloy
6.2—7.2
15—22
—
8.15—8.19
AlN Ceramic
<6
150—200
—
3.26—3.30

     

 
 
 
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